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FAB Related
Major FAB related productization activities of AAI are depicted below:
 
 
The first stage in choosing the optimal foundry is to analyze the fabrication processes and relevant technology for each design. This requires in-depth knowledge of the foundries' offerings and a thorough understanding of the product's performance requirements. After performing a comprehensive evaluation, we present our findings to the customer, who is an integral part of the vendor choice process. 

The next stages of this joint effort are to obtain quotations for NRE and wafers and to create a complete business proposal.

Once the choice of vendors is made, AAI will manage the tape-out phase, followed by manufacture of the prototype lot. Trade-off analysis of costs vs. schedule vs. risks will be performed in order to decide between full mask manufacturing or Shuttle (MPW).

Corner lot production may be required for performing device characterization and reliability tests.

We also manage wafer sort and final test program development, as well as transfer to production.

For the ASIC business model, our ASIC partners are Fujitsu Semiconductors and NXP Semiconductors.

For the COT-Plus and Turnkey Manufacturing business models, AAI partners with TSMC (Taiwan) and Tower Semiconductors (Israel).
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