Major Assembly and Test related productization activities of AAI are depicted below:
Assembly Related Productization Activities
Prior to making a choice of the assembly and test vendor, our engineering and production teams evaluate parameters such as technical and thermal characteristics of the package; existing and forecasted applications of the chip; estimated volumes of the production; vendor's capacity, location and overall profile, and availability for future test platforms.
Once the package type and vendor are selected, we will ensure that the bonding diagram and substrate design are created according to specification. Additionally, we will coordinate timely delivery of the tooling, prototype run and a smooth test program transfer to production.
AAI is capable of designing packages of any level of complexity. Some of the packages we have recently designed for our customers were:
- QFP: up to 256 lead count
- BGA: up to 1069 ball count
- Flip Chip BGA: up to 1413 ball count
- CSP
Our major assembly and test vendors are Unisem UK, China and Malaysia; ASE/ISE Group Europe, USA and Taiwan, and Amkor/Unitive USA and Korea.
Test Related Productization Activities
AAI provides test program development services. In collaboration with the customer, we prepare a test plan document which defines the various test modes that are required to fully test the device with high coverage andimpact on the design itself.
Our engineering team has extensive knowledge of all leading test platforms (such as Teradyne, Agilent, Credence etc.) and is capable of selecting the best platform to meet the requirements of our customers.
We supervise the design and manufacturing of the test hardware, such as tester loadboard, sockets, and probecard for wafer sort. We collaborate with test developers on test program generation, debug, and production integration. Our objective is to make sure that the test program is robust enough to detect any possible manufacturing flaws.
AAI's manufacturing team coordinates test program transfer to the selected foundry for the wafer sort and to the chosen assembly and/or test house for the final test. Our ultimate goal is to create a solid, stable and aligned test program at the fab and test house, which will provide high coverage wafer probing and final testing.
For test development, we work with Smartest Germany, ISE California, E&M Engineering Israel and other world leading test developing houses. 
