TSMC
Founded in 1987, TSMC is the world's largest semiconductor foundry, providing the industry's leading process technology and largest portfolio of process-proven library, IP, design tools and reference flows. It continues as the market leader by steadily increasing its capital spending and by out performing all other market competitors. Currently TSMC employs over 20,000 people worldwide and maintains account service offices in Taiwan, North America, Europe and Japan. TSMC operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at two joint ventures fab SSMC and at its wholly-owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 90-nm technology alignment program with its customers. TSMC is a trusted source to both the smallest fabless start-up ventures and to multi-national, multi-product companies.
Founded in 1987, TSMC is the world's largest semiconductor foundry, providing the industry's leading process technology and largest portfolio of process-proven library, IP, design tools and reference flows. It continues as the market leader by steadily increasing its capital spending and by out performing all other market competitors. Currently TSMC employs over 20,000 people worldwide and maintains account service offices in Taiwan, North America, Europe and Japan. TSMC operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at two joint ventures fab SSMC and at its wholly-owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 90-nm technology alignment program with its customers. TSMC is a trusted source to both the smallest fabless start-up ventures and to multi-national, multi-product companies.
Amkor Technology
Amkor is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. Amkor offers the industry's broadest array of package formats and sizes, from traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. Amkor provides leading-edge package solutions such as Stacked Packaging, Flip Chip, MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP), CMOS Image Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for latest generation applications. In addition, Amkor provides a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields.
Amkor is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. Amkor offers the industry's broadest array of package formats and sizes, from traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. Amkor provides leading-edge package solutions such as Stacked Packaging, Flip Chip, MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP), CMOS Image Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for latest generation applications. In addition, Amkor provides a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields.
ASE Group
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. With worldwide manufacturing bases and over 32,000 employees, ASE Group subsidiaries are strategically located in East Asia, and include facilities in Taiwan, South Korea, Japan, Hong Kong, Singapore and Malaysia, as well as the Americas and Europe.
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. With worldwide manufacturing bases and over 32,000 employees, ASE Group subsidiaries are strategically located in East Asia, and include facilities in Taiwan, South Korea, Japan, Hong Kong, Singapore and Malaysia, as well as the Americas and Europe.
Fujitsu Semiconductors
As a leading global ASIC provider and total-solutions provider, Fujitsu delivers innovative solutions that enable customers to differentiate their products and maximize their time-to-market advantage. Fujitsu's advanced technologies and products include its high end deep submicron process (90 nanometers), .11µm, .18µm) and standard (.65um, .35um & .25µm), process technology. Embedded memory with access time faster than 2ns helps delivering the required system performance of today's SOC designs.
Utilizing its established CMOS process technologies Fujitsu offers products tailored for optimized technical and commercial solutions. Fujitsu offers a wide brange of technologies from 0.65μm to 90nm and beyond to meet customer needs. Fujitsu produces a comprehensive lineup of packages. In addition to surface-mounted packages QFP and HQFP, Fujitsu provides packages that include BGA and FCBGA to meet the application requirements of high pin-count. Fujitsu are offering wafer foundry services and special process options e.g. for LCOS type applications. AAI is an official Distributor and Certified Design Center of Fujitsu Microelectronics.
ISE Labs
ISE Labs, Inc., located in Fremont, California, is the largest semiconductor test engineering service provider in the Silicon Valley. Our turnkey solutions include package design/selection, assembly, front-end engineering test, wafer probing, final test, qualification, reliability tests , and project/logistic management. ISE Labs, Inc. is a wholly-owned subsidiary of ASE Test Limited, the largest independent provider of semiconductor services in the world. ISE Labs, Inc. headquarters are in Fremont - California. Other ISE Labs, Inc. facilities include Austin - Texas, and Singapore.
Samsung Semiconductor Europe
Samsung Semiconductor Europe, a wholly owned subsidiary of Samsung Electronics Co. Ltd., is headquartered in Eschborn near Frankfurt/Main, Germany and operates offices all over Europe, Middle East & Africa (EMEA). The European headquarter is handling the marketing and sales activities of Samsung Electronics' component businesses units including Memory, System LSI, LED and Display business in EMEA. For more information, please visit www.samsung.com/semiconductor.
Tower Semiconductor
Tower Semiconductor Ltd. (Nasdaq: TSEM, TASE: TSEM) is an independent specialty foundry that delivers customized solutions in a variety of advanced CMOS technologies, including digital CMOS, mixed-signal and RF (radio frequency) CMOS, CMOS image sensors, power management devices, and embedded non-volatile memory solutions. Towerגs customer orientation is complemented by its uncompromising attention to quality and service. Its specialized processes and engineering expertise provides highly flexible, customized manufacturing solutions to fulfill the increasing variety of customer needs worldwide. Boasting two world-class manufacturing facilities with standard and specialized process technologies ranging from 1.0- to 0.13-micron, Tower Semiconductor provides exceptional design support and technical services to help customers sustain long-term, reliable product performance, while delivering on-time and on-budget results. AAI has been cooperating with Tower since 1997 and has completed many designs in a wide range of technologies: 0.6u, 0.5u, 0.35u in Fab-1 and 0.18u in Fab-2. AAI is Tower's Authorized Design Center.
Xilinx
Xilinx is the world's leading innovator of programmable logic solutions. Xilinx supplies customers with "off-the-shelf" logic devices that customers can program to perform specific functions using the development tools we provide. Xilinx leads the Programmable Logic Device (PLD) market -- one of the fastest growing segments of the semiconductor industry. This market features a revolutionary technology called the field programmable gate array (FPGA) that the company pioneered in 1984. Xilinx has almost half of the $2.3 billion PLD market. This programmability provides a revolutionary alternative to fixed or custom logic devices that typically require many months to design, test, and manufacture. Xilinx customers enjoy the benefit of faster time-to-market and increased product design flexibility as a result.