Samsung Semiconductor Europe
 Samsung Semiconductor Europe, a wholly owned subsidiary of Samsung Electronics Co. Ltd., is headquartered in Eschborn near Frankfurt/Main, Germany and operates offices all over Europe, Middle East & Africa (EMEA). The European headquarter is handling the marketing and sales activities of Samsung Electronics' component businesses units including Memory, System LSI, LED and Display business in EMEA. For more information, please visit
Amkor Technology 
 Amkor is a leading provider of advanced semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. Amkor offers the industry's broadest array of package formats and sizes, from traditional, "off-the-shelf" leadframe configurations to leading-edge chip scale, flip chip and system-in-package solutions incorporating highly customized designs. Amkor provides leading-edge package solutions such as Stacked Packaging, Flip Chip, MicroLeadFrame®, System-in-Package, MEMS, Wafer Level Packaging (WLP), CMOS Image Sensor Camera Modules, and Game, Memory and I/O Cards (AmkKard®) for latest generation applications. In addition, Amkor provides a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization. Amkor is a major provider of RF test services and is the world leader in Strip Test, an innovative, highly parallel test solution that offers customers low cost, faster index time and improved test yields. 
ASE Group  
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. With worldwide manufacturing bases and over 32,000 employees, ASE Group subsidiaries are strategically located in East Asia, and include facilities in Taiwan, South Korea, Japan, Hong Kong, Singapore and Malaysia, as well as the Americas and Europe. 
eASIC Corporation
eASIC is a fabless semiconductor company offering breakthrough Structured ASIC devices aimed at dramatically reducing  the overall fabrication cost and time of customized semiconductor chips. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology of FPGA-like programmable logic coupled with ASIC-like Via-layer customizable routing. This innovative fabric efficiently employs mask-less customization with Direct-write e-Beam, and thus allows eASIC to offer Structured ASICs with no mask-charges.Founded in 1999, eASIC Corporation is privately held, headquartered in Santa Clara, California. Investors include Vinod Khosla, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, and Evergreen Partners.www.eASIC.comAAI is a Distributor and Design Center of eASIC Corporation.  
Fujitsu Semiconductors   
As a leading global ASIC provider and total-solutions provider, Fujitsu delivers innovative solutions that enable customers to differentiate their products and maximize their time-to-market advantage. Fujitsu's advanced technologies and products include its high end deep submicron process (90 nanometers), .11µm, .18µm) and standard (.65um, .35um & .25µm), process technology. Embedded memory with access time faster than 2ns helps delivering the required system performance of today's SOC designs. 
Utilizing its established CMOS process technologies Fujitsu offers products tailored for optimized technical and commercial solutions. Fujitsu offers a wide brange of technologies from 0.65μm to 90nm and beyond to meet customer needs. Fujitsu produces a comprehensive lineup of packages. In addition to surface-mounted packages QFP and HQFP, Fujitsu provides packages that include BGA and FCBGA to meet the application requirements of high pin-count. Fujitsu are offering wafer foundry services and special process options e.g. for LCOS type applications. AAI is an official Distributor and Certified Design Center of Fujitsu Microelectronics.
ISE Labs    
ISE Labs, Inc., located in Fremont, California, is the largest semiconductor test engineering service provider in the Silicon Valley. Our turnkey solutions include package design/selection, assembly, front-end engineering test, wafer probing, final test, qualification, reliability tests , and project/logistic management. ISE Labs, Inc. is a wholly-owned subsidiary of ASE Test Limited, the largest independent provider of semiconductor services in the world. ISE Labs, Inc. headquarters are in Fremont - California. Other ISE Labs, Inc. facilities include Austin - Texas, and Singapore.
ITH Israeli Test House
ITH supports the back-end design and production stages of the Semiconductor Industry, serving VLSI Foundries, and Fabless Design Centers. ITH combines the expertise of its staff with state-of-the-art equipment, providing customer the best available solutions for all of VLSI back-end needs. ITH offers a comprehensive support in VLSI design, production and testing, including assembly & drop shipment. All stages required following a new product from Design to Production aresupportedby ITH, including involvement in the early stages of Physical Design, Test Plan Development, Full Characterization,Qualification &Failure Analysis Services.
NXP - Founded by Philips
NXP is a top 10 semiconductor company founded by Philips more than 50 years ago. Headquartered in Europe, the company has 37,000 employees working in 26 countries across the world. NXP creates semiconductors, system solutions and software that deliver better sensory experiences in mobile phones, personal media players, TVs, set-top boxes, identification applications, cars and a wide range of other electronic devices. AAI is NXP Distributor and Design Center.  
Smartest is a semiconductor test development company, located in Munich, Germany. Company's offering includes test concept engineering, test program generation and debug, design and manufacturing of interface boards, production integration, product analysis, and documentation and training. The development process is monitored by computerized project planning and review tools. Smartest supports a large number of tester platforms for customers all over the world.
Founded in 1987, TSMC is the world's largest semiconductor foundry, providing the industry's leading process technology and largest portfolio of process-proven library, IP, design tools and reference flows. It continues as the market leader by steadily increasing its capital spending and by out performing all other market competitors. Currently TSMC employs over 20,000 people worldwide and maintains account service offices in Taiwan, North America, Europe and Japan. TSMC operates one advanced 300mm wafer fab, five eight-inch fabs and one six-inch wafer fab. TSMC also has substantial capacity commitments at two joint ventures fab SSMC and at its wholly-owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 90-nm technology alignment program with its customers. TSMC is a trusted source to both the smallest fabless start-up ventures and to multi-national, multi-product companies. 
Tower Semiconductor 
Tower Semiconductor Ltd. (Nasdaq: TSEM, TASE: TSEM) is an independent specialty foundry that delivers customized solutions in a variety of advanced CMOS technologies, including digital CMOS, mixed-signal and RF (radio frequency) CMOS, CMOS image sensors, power management devices, and embedded non-volatile memory solutions. Towerגs customer orientation is complemented by its uncompromising attention to quality and service. Its specialized processes and engineering expertise provides highly flexible, customized manufacturing solutions to fulfill the increasing variety of customer needs worldwide. Boasting two world-class manufacturing facilities with standard and specialized process technologies ranging from 1.0- to 0.13-micron, Tower Semiconductor provides exceptional design support and technical services to help customers sustain long-term, reliable product performance, while delivering on-time and on-budget results. AAI has been cooperating with Tower since 1997 and has completed many designs in a wide range of technologies: 0.6u, 0.5u, 0.35u in Fab-1 and 0.18u in Fab-2. AAI is Tower's Authorized Design Center.  
Unisem Europe (ex-Atlantic UK) 
Located in South Wales Technology Valley, Unisem Europe (ex-Atlantic) is the most comprehensive assembly and test facility in the European contract-manufacturing marketplace. Turnkey Solutions include package design, wafer sourcing, design for test, wafer probing, assembly, final test, tape and reel as well as direct shipments to customers worldwide via proven logistics methods. In addition, control of deliveries can be controlled by customers via Unisem's e-shipping internet service. These services apply to the whole range of products, from the traditional leaded packages such as QFP, TSSOP, PLCC to the latest introduced technologies of BGA and QFN. Now the portfolio is greatly increased with the parent company in Malaysia. Package Development, Material Selection, Process Characterization are performed internally and all packages are qualified in Unisem Europe's Failure Analysis and Reliability Laboratory, according to Jedec and Q100 standards.
Unisem Group             
Unisem (M) Berhad, a leading semiconductor packaging and test services company in Malaysia, has its main packaging and test facilities in Ipoh, Malaysia. Unisem offers an integrated suite of packaging and test services for semiconductor companies such as wafer bump, wafer probe, wafer grinding, a wide range of leadframe and substrate IC packaging, high-end radio frequency and mix-signal test, tape & reel and drop-shipment services. With approximately 4,700 employees worldwide currently, Unisem has more than one million square feet of IC packaging and testing manufacturing space in Ipoh, Malaysia, Wales, United Kingdom and Chengdu, People's Republic of China and 20,000 square feet of wafer bumping facility in Ipoh, Malaysia. Unisem has a customer base comprising primarily fabless companies and to a lesser extent design houses and a small proportion of integrated device manufacturers. About 73% of Unisem's sales are to customers in North America, 24% to Europe and 3% to Asia.
Xilinx is the world's leading innovator of programmable logic solutions. Xilinx supplies customers with "off-the-shelf" logic devices that customers can program to perform specific functions using the development tools we provide. Xilinx leads the Programmable Logic Device (PLD) market -- one of the fastest growing segments of the semiconductor industry. This market features a revolutionary technology called the field programmable gate array (FPGA) that the company pioneered in 1984. Xilinx has almost half of the $2.3 billion PLD market. This programmability provides a revolutionary alternative to fixed or custom logic devices that typically require many months to design, test, and manufacture. Xilinx customers enjoy the benefit of faster time-to-market and increased product design flexibility as a result.